AMD plans to launch its third-generation EPYC processors, sometimes called Milan, in late 2020, so it's no surprise that virtually all of its partners are testing early samples of the CPUs. With thousands of samples out in the wild, leaks become all but inevitable, as we saw last weekend when preliminary information on upcoming CPUs was released. AMD's third-generation EPYC processors are based on the Zen 3 microarchitecture and feature an MCM design with nine EPYC Rome dies. Meanwhile, the new Zen Complex Core Dies (CCDs) are manufactured using an upgraded version of TSMC's 7nm processing technology. In total, the processors are configured to offer up to 64 cores with SMT, 128 PCIe 4.0 lanes, and an eight-channel DDR4-3200 memory subsystem. The new processors continue to use AMD socket SP3 and have a TDP of up to 225W - 240W.
AMD EPYC
As it turns out, AMD decided to tweak the internal design of their CCDs with their Zen 3 cores. Previously, each CCD had two basic complex quad cores (CCX) with 16MB L3 cache per CCX. With Zen 3, each CCX includes eight cores and a unified "3+MB" L32 cache. Such a CCD design reduces internal latencies and promises to improve instruction clock (IPC) performance.- Also check out our full list of the best business laptops - Best devices for working at home, SMBs, and more